제품 기본설명
Epitaxy Ready Polished Wafers
제품 상세설명
| Wafer Specifications | ||
| 2" diameter | 3" diameter | |
|---|---|---|
| Orientation | (100)±0.1° | (100)±0.1° |
| Misorientations up to 10° in direction = 45° are routinely available. | ||
| For other orientations and directions please ask. | ||
| Diameter | 50.5±0.5mm | 76.2±0.4mm |
| Flat Option | EJ | EJ |
| US/SEMI flat option is available. | ||
| Flat orientation tolerance |
±0.1° | ±0.1° |
| Wafers can also be supplied with either the major or minor flat prepared to an orientation tolerance of ± 0.02° to aid cleavage in laser manufacturing operations. | ||
| Major flat length |
16±2mm | 22±2mm |
| Minor flat length |
8±1mm | 11±1mm |
| Thickness/µm | 350±25µm or 500±25µm | 625±25µm or 635±25µm |
| Lasermark | Back surface parallel to major flat | Back surface parallel to major flat |
관련제품
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