▣ Optimized for decapsulation of microchips
▣ Short decapsulation time at gentle process conditions
▣ Very high etch rate and low cost of ownership
▣ No attack on wiring (e.g. Cu and Pd - Cu materials)
▣ Fast, isotropic etching by radicals only
▣ Slight attack of chip passivation(selectivity > 500:1)
▣ Application: 

   Chip Decapsulation on the wafer